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EH: HOT-MELT RESINS
- Crystalline
- Good adhesion to various substrates
- Excellent chemical resistance
- Wide range of heat resistance
- No environmental problems
Applications: include Automotive Filters, Label & Spangle, & FFC film
ES: SOLVENT-BORNE RESINS
- Fully Amorphous Structures: solvent soluble
- High Molecular Weight, both linear and branched grades
- Wide Tg and IV Range: Broad range of properties
- Medium Polarity: can be applied to a wide variety of substrates
- Adhesion, heat/chemical/solvent resistance, flexibility, low color, transparent
Applications: PCM for appliances, Can Coating & Ink, FFC film, & Industrial Adhesives.


EW: WATER-BORNE RESINS
- EW resins can be used as a coating and binder
- Good adhesive performance
- Amine/Ammonia-free
- Stable pH/viscosity
Applications: Sizing Agent for textiles, over print varnish (paper coating), & adhesion promoter.
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